About Chipbond
頎邦科技為擁有「覆晶封裝技術」與「晶片尺寸封裝(csp；chip scale package)」此二類先進技術之專業封裝廠商，不論是自行販賣或代工生產，在數量上佔世界舉足地位。對於封裝方式進入輕薄、短小的要求時，國內獨缺凸塊製作之產業，本公司乃投入凸塊之代工並延續後段封裝之服務。本公司為國內凸塊領域進展最快，業績屢創新高。 其產品線的規劃可完全滿足未來封裝的主流... Read more
Contact profiles Chipbond:
| Employee | Department | Total Email Source | |
|---|---|---|---|
 Shane Lin人å è³ æº è³ æ ç ç å human resource chief officer | 0 | ||
 Leonie Chen | 0 | ||
 Carol Changcustomer service | 0 | ||
 Roxan Amongomachine operator | 0 | ||
 Hikali Wangaccount manager | Sales | 0 | |
 Fu Tu | 0 | ||
 Weng Rogerdepartment manager | Management | 0 | |
 巫志弘Charlie Wuvice president | 0 | ||
 Eric Chensenior manager | 0 | ||
 Yeh-Hsiu Liusupervisor engineer | 0 | ||
 Danilo Sarmientoassistant engineer | 0 | ||
 Jason Hsieh | 0 | ||
Felix Liu | 0 | ||
Chi-Ling Sun | 0 | ||
 Michael Wu | 0 | ||
Liu Andlyssenior software engineer | Software | 0 | |
Eva Tsai人å ç ¼å é ä ä ç ç å | 0 | ||
Jawy Chiou | 0 | ||
Chin-Tang Hsiehsenior program manager | Management | 0 | |
 Neo Sunte senior department manager | 0 | ||
Joanne Lee | 0 | ||
Chi-Tang Linsenior project director | 0 | ||
 Benson Liu | 0 | ||
Calvin Yangç ç | 0 | ||
 Andy Kuomanager | Management | 0 | |
 Tony Liuproject manager | Engineering | 0 | |
 Vinai Pengå | 0 |
Chipbond Email Metrics
Chipbond has 41 email addresses.
Chipbond has 41 personal email addresses, .
Chipbond has 0 generic email addresses.
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